FSV240AF ? surface mount schottky barrier rectifier ? 2015 fairchild semiconductor corporation www.fairchildsemi.com FSV240AF rev. 1.1 august 2015 FSV240AF surface mount schott ky barrier rectifier features ? low forward voltage drop: 0.5 v maximum at 2 a, t a = 25c ? ultra thin profile - ma ximum height of 1.0 mm ? high surge capacity ? ul flammability 94v-0 classification ?msl 1 ? rohs compliant / green mold compound ? industrial device qualified per aec-q101 standards. * see authorized use policy ordering information absolute maximum ratings stresses exceeding the absolute maximum ratings may damage the device. the device may not function or be opera- ble above the recommended operating conditions and stressing the parts to these levels is not recommended. in addi- tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. the absolute maximum ratings are stress ratings only. values are at t a = 25c unless otherwise noted. part number top mark package packing method FSV240AF FSV240AF do-214ad (smaf) tape and reel symbol parameter value unit v rrm recurrent peak reverse voltage 40 v v rms rms reverse voltage 28 v v r dc blocking voltage 40 v i f(av) average forward current 2 a i fsm peak forward surge current: 8.3 ms single half sine-wave superimposed on rated load (jedec method) 50 a t j operating junction temperature range -55 to +150 c t stg storage temperature range -55 to +150 c 1 2 cathode anode smaf band indicates cathode
FSV240AF ? surface mount schottky barrier rectifier ? 2015 fairchild semiconductor corporation www.fairchildsemi.com FSV240AF rev. 1.1 2 thermal characteristics (1) values are at t a = 25c unless otherwise noted. note: 1. per jesd51-3 recommended thermal test board. device mounted on fr-4 pcb, board size = 76.2 mm x 114.3 mm. 2. thermocouple soldered at cathode lead. electrical characteristics values are at t a = 25c unless otherwise noted. symbol parameter value unit jl typical thermal characteristics, junction-to-lead (2) 15 c/w r ja typical thermal resistance, junction-to-ambient 120 c/w symbol parameter conditions min. typ. max. unit v f forward voltage i f = 2.0 a 0.5 v i r reverse current v r = 40 v 0.1 ma t rr reverse recovery time i f = 0.5 a, i r = 1 a, i rr = 0.25 a 9.65 ns c j junction capacitance v r = 4 v, f = 1 mhz 98 pf
FSV240AF ? surface mount schottky barrier rectifier ? 2015 fairchild semiconductor corporation www.fairchildsemi.com FSV240AF rev. 1.1 3 typical performance characteristics figure 1. forward current derating curve figure 2. typical reverse characteristics figure 3. typical forward characteristics figure 4. typical junction capacitance 7 & & d v h 7 h p s h u d w x u h c & , ) ) r u z d u g & x u u h q w $ , 5 5 h y h u v h & x u u h q w p $ 7 - c & 7 - c & 7 - c & 7 - c & 9 3 h d n 5 h y h u v h 9 r o w d j h 9 9 5 3 h d n 5 h y h u v h 9 r o w d j h 9 , ) ) r u z d u g & x u u h q w $ 9 ) r u z d u g 9 r o w d j h 9 7 - c & 7 - c & 7 - c & 7 - c & 0 5 10 15 20 25 30 35 40 0 50 100 150 200 250 300 junction capacitance, c j [pf] reverse voltage, v r [v]
FSV240AF ? surface mount schottky barrier rectifier ? 2015 fairchild semiconductor corporation www.fairchildsemi.com FSV240AF rev. 1.1 4 physical dimensions figure 5. 2-lead, smaf, non jedec flat lead 1 2 7 ( 6 $ 7 + , 6 3 $ & . $ * ( ' 2 ( 6 1 2 7 & 2 1 ) 2 5 0 7 2 $ 1 < 6 7 $ 1 ' $ 5 ' 6 % $ / / ' , 0 ( 1 6 , 2 1 6 $ 5 ( , 1 0 , / / , 0 ( 7 ( 5 6 & ' , 0 ( 1 6 , 2 1 6 $ 5 ( ( ; & / 8 6 , 9 ( 2 ) % 8 5 5 6 0 2 / ' ) / $ 6 + $ 1 ' 7 , ( % $ 5 3 5 2 7 5 8 6 , 2 1 6 ' / $ 1 ' 3 $ 7 7 ( 5 1 5 ( & 2 0 0 ( 1 ' $ 7 , 2 1 3 ( 5 , 3 & 6 2 ' ) / ; 1 ( ' 5 $ : , 1 * ) , / ( 1 $ 0 ( 0 . 7 ' 2 $ ' 5 ( 9 / $ 1 ' 3 $ 7 7 ( 5 1 5 ( & 2 0 0 ( 1 ' $ 7 , 2 1
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